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TechQuiet 13d · day 16

Samsung, TSMC commit to ASML's High NA EUV tools, joining Intel

Chipmakers set 2028 and 2030 adoption dates for ASML's newest lithography machines and agree to move to larger 12-inch photomasks as AI demand grows.

newest coverage 12d agosummary written 16d ago65 pieces10 likes & upvotes MastodonNewswiresGoogle NewsRedditHacker NewsX

What to know

  • Samsung and TSMC now join Intel in committing to ASML's High NA EUV lithography machines, with Samsung targeting 2028 and TSMC 2030.
  • All four chipmakers are shifting from legacy 6-inch photomasks to larger 12-inch photomasks to support the new tools.
  • The moves are driven by surging AI chip demand, which requires smaller and more complex semiconductor nodes.
  • DigiTimes notes TSMC is the only one of the four to specify a firm rollout timeline, leaving Samsung's and Intel's pacing less certain.

“Overcoming the Limits of Semiconductor Miniaturization”

Samsung Electronics and ASML, Joint announcement framing · The Asia Business Daily ↗ · Sep 7

ASML Dutch lithography equipment makerSamsung Electronics Memory and foundry chipmakerTSMC Contract chip foundryIntel Foundry Chipmaker and foundry

Samsung, TSMC commit to ASML's High NA EUV tools, joining Intel
Engadget

How it unfolded 3 developments, newest first · click a bar or a number to jump articlesposts

Peak 42 pieces in 4h at Sep 8, 5 AM; 65 pieces over 16 days (51 articles · 14 posts) Sep 8, 1 AM — 10 pieces · 8 articles · 2 posts — Google News 5, Newswires 3, Mastodon 2Sep 8, 5 AM — 42 pieces · 36 articles · 6 posts — Newswires 36, X 3, Mastodon 2, +1 moreSep 8, 9 AM — 8 pieces · 2 articles · 6 posts — Hacker News 2, Newswires 2, Mastodon 2, +1 moreSep 8, 1 PM — 2 pieces · 2 articles — Google News 2Sep 8, 5 PM — quietSep 8, 9 PM — 1 piece · 1 article — Newswires 1Sep 9, 1 AM — quietSep 9, 5 AM — quietSep 9, 9 AM — quietSep 9, 1 PM — quietSep 9, 5 PM — quietSep 9, 9 PM — quietSep 10, 1 AM — quietSep 10, 5 AM — 1 piece · 1 article — Newswires 1Sep 10, 9 AM — quietSep 10, 1 PM — quietSep 10, 5 PM — quietSep 10, 9 PM — quietSep 11, 1 AM — quietSep 11, 5 AM — quietSep 11, 9 AM — 1 piece · 1 article — Newswires 1Sep 11, 1 PM — quietSep 11, 5 PM — quietSep 11, 9 PM — quietSep 12, 1 AM — quietSep 12, 5 AM — quietSep 12, 9 AM — quietSep 12, 1 PM — quietSep 12, 5 PM — quietSep 12, 9 PM — quietSep 13, 1 AM — quietSep 13, 5 AM — quietSep 13, 9 AM — quietSep 13, 1 PM — quietSep 13, 5 PM — quietSep 13, 9 PM — quietSep 14, 1 AM — quietSep 14, 5 AM — quietSep 14, 9 AM — quietSep 14, 1 PM — quietSep 14, 5 PM — quietSep 14, 9 PM — quietSep 15, 1 AM — quietSep 15, 5 AM — quietSep 15, 9 AM — quietSep 15, 1 PM — quietSep 15, 5 PM — quietSep 15, 9 PM — quietSep 16, 1 AM — quietSep 16, 5 AM — quietSep 16, 9 AM — quietSep 16, 1 PM — quietSep 16, 5 PM — quietSep 16, 9 PM — quietSep 17, 1 AM — quietSep 17, 5 AM — quietSep 17, 9 AM — quietSep 17, 1 PM — quietSep 17, 5 PM — quietSep 17, 9 PM — quietSep 18, 1 AM — quietSep 18, 5 AM — quietSep 18, 9 AM — quietSep 18, 1 PM — quietSep 18, 5 PM — quietSep 18, 9 PM — quietSep 19, 1 AM — quietSep 19, 5 AM — quietSep 19, 9 AM — quietSep 19, 1 PM — quietSep 19, 5 PM — quietSep 19, 9 PM — quietSep 20, 1 AM — quietSep 20, 5 AM — quietSep 20, 9 AM — quietSep 20, 1 PM — quietSep 20, 5 PM — quietSep 20, 9 PM — quietSep 21, 1 AM — quietSep 21, 5 AM — quietSep 21, 9 AM — quietSep 21, 1 PM — quietSep 21, 5 PM — quietSep 21, 9 PM — quietSep 22, 1 AM — quietSep 22, 5 AM — quietSep 22, 9 AM — quietSep 22, 1 PM — quietSep 22, 5 PM — quietSep 22, 9 PM — quietYesterday, 1 AM — quietYesterday, 5 AM — quietYesterday, 9 AM — quietYesterday, 1 PM — quietYesterday, 5 PM — quietYesterday, 9 PM — quietToday, 1 AM — quietToday, 5 AM — quiet 1–3
Sep 10Sep 12Sep 14Sep 16Sep 18Sep 20Sep 22now · 9:13 AM ET
  1. 2

    DigiTimes notes only TSMC has fixed a rollout date

    DigiTimes coverage points out that while ASML has lined up Intel, TSMC and Samsung behind the 12-inch mask transition, TSMC alone has set an explicit timeline, leaving the pace of Samsung's and Intel's rollouts less certain.

    1. 1 outlet ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline

      first by DigiTimes, 16d ago

    • 📢High NA EUV is being adopted for production of leading-edge chips in both logic and memory. Now it's time to look to the future: With TSMC, we're rallying the chip industry around larger masks to give High NA EUV a productivity boost. Learn more 👇

      @asmlcompanyX16d agoview on X ↗
    2 more of the top 3 · 4 posts in this stretch

    • Get the most important and interesting news from the global economy delivered to your inbox. https:// qz.com/tsmc-samsung-asml-high- na-euv-ai-chips-090826?utm_source=flipboard&utm_medium=activitypub Posted into Business News @ business-news-quartz

      quartz@flipboard.comMastodon16d agoview on Mastodon ↗

    • This is big. $INTC & $TSM moving to 6x12" masks. Will mean High-NA EUV can do the same reticle size as Low NA EUV by doubling the mask size. $INTC is ahead, working w. IMS Nano & ASML + lots of interest from large reticle-size GPU designers. The added weight of $TSM helps

      @intellionaireX16d agoview on X ↗
    all of them →
  2. background

    Intel Foundry and ASML report a High NA EUV milestone — Intel Foundry and ASML separately report a production milestone for High NA EUV, underscoring Intel's head start in deploying the technology ahead of Samsung and TSMC.

  3. 3

    Samsung and TSMC set 2028/2030 dates for High NA EUV

    Samsung and ASML announce an expanded strategic collaboration, with Samsung committing to High NA EUV adoption by 2028 for next-generation DRAM and TSMC by 2030; both join Intel, and all four companies agree to shift from 6-inch to 12-inch photomasks.

    1. 5 outlets Intel and ASML push High NA EUV toward wider production

      first by eeNews Europe, 16d ago · also KED Global, Korea JoongAng Daily, Bloomberg, Tom's Hardware

      4 more headlines
    2. 5 outlets Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing

      first by Samsung Newsroom, 16d ago · also The Asia Business Daily, Seoul Economic Daily, ASML, Samsung Global Newsroom

      2 more headlines
    1 more claim →
  4. 1

    ASML wins EUV tool commitments from TSMC and Samsung

    Bloomberg reports ASML has secured commitments from top chipmakers, including TSMC and Samsung, to use its latest production gear as part of a broader push to meet surging AI-driven chip demand.

    “ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking on a broader agreement to meet surging demand for more powerful artificial intelligence technology.”
    — Bloomberg
    1. 5 outlets TSMC and Samsung commit to ASML High NA EUV machines for AI chips

      first by Quartz, 16d ago · also SamMobile, Focus Taiwan, Yahoo Finance, The Daily Upside

      4 more headlines
    2. 2 outlets Intel Foundry and ASML report High NA EUV production milestone

      first by Evertiq, 16d ago · also Intel

      1 more headline
    5 more claims →

Also covered reported alongside — the timeline has no entry for these yet

  1. 4 outlets TSMC to use ASML's next-gen machines for high-volume chip manufacturing

    first by Phoenix Business Journal, 16d ago · also Forbes, HotHardware, SammyGuru

    3 more headlines
  2. 2 outlets Samsung, ASML expand partnership to introduce next-gen lithography by 2028

    first by The Korea Times, 16d ago · also eeNews Europe

    1 more headline

and 6 smaller pieces

What people are saying 1 voices from 1 site · best of 4 · verbatim